Masood Murtuza

Masood Murtuza is Manager of the Package Development Group responsible for Flip Chip and Stack packages in the Semiconductor Packaging Development (SCPD) division at Texas Instruments. He is responsible for developing IC packages for mobile applications. Masood was elected a TI Fellow in 2001; prior to that he was a Distinguished Member of the Technical Staff and managed various packaging development groups at TI. During his tenure of over 20 years he also served at a TI Semiconductor factory in Singapore where he established an Advanced Packaging Development Group for DRAMs (Dynamic Random Access Memory). In Singapore he set up joint research programs with the National University of Singapore and Nanyang Technology University. Masood has authored or co-authored over eight papers in IC packaging and holds eight US patents. He was among the first in the industry to use modeling and simulations in package analysis. One of his co-authored papers on modeling was given the Outstanding Paper Award by the IEEE Reliability Physics Symposium. From 1997-2003 Masood served on the Advanced Packaging committee of the Electronics Components Technology Committee. Masood received his Bachelor’s degree in Mechanical Engineering from the Indian Institute of Technology, Madras, India, and his master’s degree in Naval Architecture from University College, the University of London, UK. Masood is married with three children, and works out of Houston.