Donald
C. Price, Ph.D., P.E.
Donald Price received the BSME and the MSME from SMU
in Dallas, Texas, and the PhD from Oklahoma State University in
Stillwater, Oklahoma. Dr. Price served as a member of the faculty
of the Mechanical Engineering Department at Southern Methodist University
from 1965 to 1970 and has served as an Adjunct Professor at in that
Department since 1985. Currently, Dr. Price is a Principal Engineering
Fellow in the Thermal Technology Branch of Raytheon Network Centric
Systems in McKinney, Texas.
In this capacity, Dr. Price is responsible for the
thermal management of a wide range of Raytheon products, including
airborne missile systems, airborne- and ground-based electro-optics
systems, and phased-array radar systems. This activity involves
thermal model simulations of military systems and the computer-aided
design of coldplates and heat exchangers. The work also includes
the thermal design of airborne electronic pods cooled by vapor-cycle
or air-cycle refrigeration systems.
Dr. Price currently serves on a number of University Industry Advisory
Boards, including the SMU Mechanical Engineering Department Board
for Knowledge. Dr. Price is a member of several technical and professional
societies: ASME, IEEE, AIAA, IMAPS, TSPE, NSPE, and ASEE. The ASME
North Texas Section (NTS) Electronic and Photonic Packaging Division
(EPPD) selected Dr. Price as Engineer-of-the-Year for 1997, and
the ASME NTS selected him as the Engineer-of-the-Year for 1998.
The Dallas Chapter of the Texas Society of Professional Engineers
honored Dr. Price as Engineer-of-the-Year for 2001-02. Dr. Price
was further honored as an ASME Fellow in 2002 and was designated
as an ASME Life Fellow in 2004. Dr. Price also serves as Chairman
of the ASME North Texas Section Industry Advisory Board.
At the national level of ASME, he has served
as a member of the K-16 Committee on Heat Transfer in Electronic
Systems since 1996. He served as Vice-Chair of this committee from
2000 to 2003 and as Chairman from 2003-05. Dr. Price has been a
member of the ASME Electronics and Photonics Packaging Division
(EPPD) since 1996. He became a member of the EPPD Executive Committee
in 2001 and served the committee as Secretary from 2002-03, Treasurer
from 2003-04, Vice-Chairman from 2004-05, and is currently serving
as Chairman for 2005-06. Dr. Price served the ASME InterPack Conference
as a Session Chair in 1997, Thermal Management Track Chair in 1999,
Conference Program Chair in 2001, and General Chair of the conference
in 2003. Dr. Price currently serves as a technical reviewer for
the ASME J. of Heat Transfer and the ASME J. of Electronic Packaging.
As an employee of Raytheon, Dr. Price has been issued five US patents
and three foreign patents. In addition, he is co-inventor of one
US Patent Application, which has been filed and is currently pending.
He has published numerous technical papers in referred journals
and conference proceedings. He has made technical presentations
at society conferences and numerous presentations on professionalism
(Ten Keys to a Successful Engineering Career) to a variety of engineering
and student groups. Don Price has been married to his wife, Barbara,
for 48 years, and they consider themselves fortunate to have been
parents to four children. They are most proud of their seven grandchildren.
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