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 TMAPPER: Ultrafast Self-Adaptive Thermal Modeling
 

Thank you for your interest in our ultrafast self-adaptive thermal modeling code. We will gladly send you, upon request, a trial (limited) version of our more sophisticated patented system.

Please send us an email or contact us using the information provided at http://engr.smu.edu/netsl/contactus.html


Thank you,
NETSL Team



TMAPPER TERMS OF USE

   We provide TMapper for your use, free of charge, and hope that it would be of significant help in your thermal analysis work.  The condition for this use, however, is that you acknowledge our work and code in your reports and other forms of publication, both internal and external to your organization (see Acknowledgments below).  In addition, we request that you provide us with reference information on the problem that you have used TMapper to solve.  Your feedback, either in the form of a testimonial or suggestion, is important to us as we continue to improve our ultra-fast, self-adaptive, thermal modeling capabilities.

   The version of TMapper that is presently provided on our web site is a limited version of our more sophisticated patented system.  The limited version is for steady-state problems and can accommodate a maximum of ten layers of materials.  The full version has no limitations in terms of number of materials, adjacencies, or geometric features.  It is fully automatic and adaptive, independent of user expertise, and provides, for the first time, the ability to perform parametric analyses on fully nonlinear, pulsed devices.  The full version also provides the ability to extract the complete set of simulation data for visualization in a commercial package, such as Tecplot.

    We hope that you will enjoy the use of this truly amazing capability. Let us know if we can be of assistance in your computations or in your measurements of stacked layers of nanoscale structures.

Disclaimer of warranty and limitation of liability
In no event shall NETSL be liable for any direct, indirect or consequential damages or any damages whatsoever (including but not limited to loss of use, data, or profits) with respect to, arising out of, in connection with, or related to the use of TMapper.

Acknowledgments
"TMapper: A web-based, ultra-fast, self-adaptive, transient thermal simulation method for complex nanoscale electronic devices," Peter E. Raad and Pavel L. Komarov, http://engr.smu.edu/netsl/tmapper.html, 2002.
Tmapper is based on "System and Method for Predicting the Behavior of a Component," Peter E. Raad, James S. Wilson, and Donald C. Price, U.S. Patent No. 6,064,810, Issued May 16, 2000.  The method and system are described in "Adaptive Modeling of the Transients of Sub-Micron Integrated Circuits," Peter E. Raad, James S. Wilson, and Donald C. Price, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 21, No. 3, Sep. 1998.





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