•  "Self-Adaptive Dynamic Thermal Simulation of Microwave Integrated Circuits", James WILSON, Ph.D. Dissertation, SMU, Dallas, TX, 1997.

•  “Transient Thermoreflectance Measurements of the Thermal Properties of Metallized Thin Film Electronics Materials”, Mihai G. BURZO, Ph.D. Dissertation, SMU, Dallas, TX, 2001.

•  “A New Simulation Model of Electro-Thermal Degradation for MOSFET Devices Subjected to Hot Carrier Injection Stress”, Gunhan KAYTAZ, Ph.D. Dissertation, SMU, Dallas, TX, December 2004.

• ”Non-Contact Transient Temperature Mapping Of Active Electronic Devices Using The Thermoreflectance Method,” Mihai G. Burzo, Pavel L. Komarov, and Peter E. Raad, IEEE Transactions on Components and Packaging Technologies, Vol. 28(4), pp. 637- 643, 2005.   [View / Download PDF]

• “Minimizing the Uncertainties Associated with the Measurement of Thermal Properties by the Transient Thermo-Reflectance Method,” M. G. Burzo, P. L. Komarov, and P. E. Raad, IEEE Transactions on Components and Packaging Technologies, Vol. 39, pp. 39-44, 2005.  [View / Download PDF]

•  “A Transient Self-Adaptive Technique for Modeling Thermal Problems with Large Variations in Physical Scales,” J. S. Wilson and P. E. Raad, International Journal of Heat and Mass Transfer, Vol. 47, pp. 3707-3720, 2004. [View / Download PDF]

•  “Performance Analysis of the Transient Thermo-Reflectance Method for Thermal Conductivity of Single Layer Materials,"  Pavel L. KOMAROV, and Peter E. RAAD, International Journal of Heat and Mass Transfer, Vol. 47, pp. 3233-3244, 2004. [View / Download PDF]

•  "Transient Thermo-Reflectance Measurements of the Thermal Conductivity and Interface Resistance of Metallized Natural and Isotopically-Pure Silicon,” Pavel L. KOMAROV, Mihai G. BURZO, Gunhan Kaytaz, and Peter E. RAAD, Microelectronics Journal, Vol. 34, No. 12, pp. 1115-1118, 2003. [View / Download PDF]

•  "Influence of a Metallic Absorption Layer on the Quality of Thermal Conductivity Measurements by the Transient Thermo-Reflectance Method,” Mihai G. BURZO, Pavel L. KOMAROV, and Peter E. RAAD, Microelectronics Journal, Vol. 33, pp. 697–703, 2002. [View / Download PDF]

•  “Thermal Transport Properties of Gold-Covered Thin-Film Silicon Dioxide,” Mihai G. BURZO, Pavel L. KOMAROV, Peter E. RAAD, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 1, pp. 80-88, March 2003. [View / Download PDF]

•  “A Study of the Effect of Surface Metallization on Thermal Conductivity Measurements by the Transient Thermo-Reflectance Method,” Mihai G. BURZO, Pavel L. KOMAROV, and Peter E. RAAD, Journal of Heat Transfer, Vol. 124, pp. 1009-1019, December 2002. [View / Download PDF]

•   “Adaptive Modeling of the Transients of Sub-Micron Integrated Circuits“, Raad, P.E., J.S. Wilson, and D.C. Price, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 21, No. 3, page 412, September 1998.
  

•  "A Fractional-Diffusion Theory for Calculating Thermal Properties of Thin Films From Surface Transient Thermoreflectance Measurements," Kulish, Vladimir V; Lage, Jose L; Komarov, Pavel L, and Peteer E Raad, Journal of Heat Transfer, Vol. 123, No. 6, pp. 1133-1139, 2001.

•  “Fluid Flow Regimes in a Combustion Duct Induced by Natural Convection,” Mihai G Burzo, Dani Fadda and Peter E. Raad, prepared for International Journal of Heat and Mass Transfer, 2004.
  

•  “Study on the Uncertainties Associated with the Measurements of Thermal Properties by the Transient Thermo-Reflectance Method”, Mihai G. BURZO, Pavel L. KOMAROV, and Peter E. RAAD, prepared for International Journal of Heat and Mass Transfer, 2004.
  

•  “An Integrated Experimental and Computational System for the Thermal Characterization of Complex Three-Dimensional Submicron Electronic Devices,” Raad, Pavel L. Komarov and Mihai G. Burzo, 11th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Belgirate, Lake Maggiore, Italy, 27 - 30 September 2005. [View / Download PDF]

•  “An Optimized Thermo-Reflectance Technique for Thermal Conductivity Measurements of Thin-Film Electronic Materials,” Mihai G. Burzo, Pavel L. Komarov, and Peter E. Raad, 28th International Thermal Conductivity Conference (ITCC) and the 14th International Thermal Expansion Symposium (ITES), New Brunswick, Canada, June 26-29, 2005. [View / Download PDF]

• “Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning,” Pavel L. Komarov, Mihai G. Burzo, and Peter E. Raad, Proceedings to the Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS and Electronic Systems (InterPACK), San Francisco, Ca, July 17-22, 2005. [View / Download PDF]

• “A Thermoreflectance Thermography System for Measuring the Transient Surface Temperature of Active Microelectronic Devices,” Pavel L. Komarov, Mihai G. Burzo, and Peter E. Raad, 15th European Microelectronics and Packaging Conference & Exhibition, Brugge, Belgium, June 12 - 15, 2005. [View / Download PDF]

•  "Non-Contact Transient Temperature Mapping of Active Electronic Devices Using the Thermoreflectance Method”, Mihai G. BURZO, Pavel L. KOMAROV, and Peter E. RAAD, 10th International Workshop on THERMAL INVESTIGATIONS of ICs and Systems, Sophia Antipolis, Côte d'Azur, France, September 29 -  October 1, 2004. [View / Download PDF]

• “Non-contact Thermal Conductivity Measurements of Gold Covered Natural and Isotopically-Pure Silicon and Their Respective Oxides,” Mihai G. BURZO, Pavel L. KOMAROV, and Peter E. RAAD, 5th International Conference on Thermal, Mechanical and Thermo-mechanical Simulation and Experiments in Micro-electronics and Micro-systems (EUROSIME 2004), Brussels, Belgium, May 10-12, 2004. [View / Download PDF]

• "Minimizing the Uncertainties Associated with the Measurements of Thermal Properties by the Transient Thermo-Reflectance Method”, Mihai G. BURZO, Pavel L. KOMAROV, and Peter E. RAAD, 2002, 9th International IEEE Workshop on THERMal INvestigations of ICs and Systems (THERMINIC 2003), Aix-en-Provence, France, September 24-26, 2003. [View / Download PDF]

•  "A New Simulation Model of Electro-Thermal Degradation for MOSFET Devices Subjected to Hot Carrier Injection Stress", Gunhan KAYTAZ, Pavel L. KOMAROV, and Peter E. RAAD, 2002, 9th International IEEE Workshop on THERMal INvestigations of ICs and Systems (THERMINIC 2003), Aix-en-Provence, France, September 24-26, 2003. [View  / Download PDF]

•  “Thermal Transport Properties of Gold-Covered Thin-Film Silicon Dioxide”, Mihai G. BURZO, Pavel L. KOMAROV, and Peter E. RAAD, International Conference on Thermal, Mechanics and Thermo-mechanical Phenomena in Electronic Systems (ITHERM 2002), San Diego, California, May 29 - June 1, 2002.[View / Download PDF]
   
•  “Transient Thermo-Reflectance Measurements of the Thermal Conductivity and Interface Resistance of Metallized Natural and Isotopically-Pure Silicon,” Pavel L. KOMAROV, Mihai G. BURZO, Gunhan KAYTAZ, and Peter E. RAAD, 8th International IEEE Workshop on THERMal INvestigations of ICs and Systems (THERMINIC 2002),  Madrid, Spain, October 1-4, 2002.[View / Download PDF] 
  

• “A Study of the Effect of Surface Metallization on Thermal Conductivity Measurements by the Transient Thermo-Reflectance Method”, Mihai G. BURZO, Pavel L. KOMAROV, and Peter E. RAAD, ASME International Mechanical Engineering Congress and Exposition (IMECE 2002), New Orleans, Louisiana, USA, November 17-22, 2002. [View / Download PDF]

• “Influence of a Metallic Absorption Layer on the Quality of Thermal Conductivity Measurements by the Transient Thermo-Reflectance Method,” Mihai G. BURZO, Pavel L. KOMAROV, and Peter E. RAAD, 2001, 7th International IEEE Workshop on THERMal INvestigations of ICs and Systems (THERMINIC 2001), Paris, France, September 24-27, 2001. [View / Download PDF]

• Transient Adaptive Thermal Simulation of Microwave Integrated Circuits," J. S. Wilson, P. E. Raad, and D. C. Price, 14th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 1998), San Diego, California, March 1998.

•  "Adaptive Modeling of the Transients of Submicron Integrated Circuits," P. E. Raad, J. S. Wilson, and D. C. Price, Third International Workshop on Thermal Investigations of ICs and Microstructures (THERMINIC 1997), Cannes, France, Sep. 1997.

• “Buoyancy Induced Flow in a Vertical Combustion Discharge Duct,” Mihai G. BURZO, Dani FADDA  and Peter E. RAAD, 1999, Proceedings of the 3rd ASME/JSME Joint Fluids Engineering Conference, San Francisco, California, July 18-23, 1999. [View / Download PDF]

• “Instability Regimes for Buoyancy Induced Flows in a Non-uniformly Cooled Duct,” Mihai G. BURZO, Dani FADDA and P.E. RAAD, 1998, American Physical Society - Division of Fluid Mechanics, Philadelphia, Pennsylvania, November 22-24, 1998. [View / Download  Power Point Presentation]

   Patents

• Raad, P., J. Wilson, and D. Price,  “System and Method for Predicting the Behavior of a Component”, U.S. Patent No. 6,064,810, Issued May 16, 2000.

• "Breakthroughs for Electronics Manufacturing by Thermal Modeling and Measurement of Submicron Integrated Circuits", SMU Brochure, 2000.

   Conference Presentations

• 22nd Semiconductor Thermal Measurement, Modeling, and Management Symposium (Semi-Therm 22, 2006), Dallas, Texas, USA, expected March 14-16, 2006.
• 11th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2005), Belgirate, Lake Maggiore, Italy, 27 - 30 September 2005.
• 28th International Thermal Conductivity Conference (ITCC-28 2005) and the 14th International Thermal Expansion Symposium (ITES), New Brunswick, Canada, June 26-29, 2005.
• The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS and Electronic Systems (ASME InterPACK '05), San Francisco, California, USA, July 17-22, 2005.
• 15th European Microelectronics and Packaging Conference & Exhibition (EMPC), Brugge, Belgium, June 12 - 15, 2005.
• 10th International Workshop on THERMAL INVESTIGATIONS of ICs and Systems (THERMINIC 2004), Sophia Antipolis, Côte d'Azur, France, September 29 -  October 1, 2004
• 5th International Conference, on Thermal, Mechanical and Tthermo-Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems (Eurosime 2004), Brussels, Belgium, May 10th to 12th, 2004.
• 9th Internationl  IEEE Workshop on THERMal INvestigations of ICs and Systems (THERMINIC 2003), September 24-26, 2003, Aix-en-Provence.
• 8th International IEEE Workshop on THERMal INvestigations of ICs and Systems (THERMINIC 2002), October 1-4, 2002, Madrid, Spain
• International Conference on Thermal, Mechanics and Thermo-mechanical Phenomena in Electronic Systems (ITherm 2002), May 29 - June 1, 2002, San Diego, California
• International Mechanical Engineering Congress and Exposition (ASME IMECE), November 17-22, 2002, New Orleans, Louisiana, USA
• 7th International IEEE Workshop on THERMal INvestigations of ICs and Systems (THERMINIC 2001), September 24-27, 2001, Paris, France
• 3rd ASME/JSME Joint Fluids Engineering Conference,  July 18-23, 1999, San Francisco, California
• 14th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 1998), San Diego, CA, March 1998
• 51st Meeting of the Division of Fluid Dynamics of the American Physical Society, Philadelphia PA., November 22-24, 1998
• 3rd International Workshop on Thermal Investigations of ICs and Microstructures (THERMINIC 1997), Cannes, France, Sep. 1997

   Expositions

• SEMICON West Semiconductor Trade Show, Wafer Processing and MEMS/NEMS – July 12-14, 2004,  Moscone Center, San Francisco, CA  (SEMICON West 2004)
  
• NEPCON Texas, trade event and conference, October 19-21, 2004, Arlington Convention Center, Arlinghton, TX  (NEPCON Texas 2004)