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Problems associated with
the performance, reliability, and life cycle of microelectronic devices
ultimately manifest themselves through excessive temperature levels and
associated material degradation. These problems can be addressed either
at the
design stage or during field operation. During design, the objective
would be
to avoid to the extent possible thermal issues altogether by
intelligent
concurrent electro-thermal analysis. In field operations, the objective
would
be to diagnose the source and extent of performance degradation of an
existing
device in order to predict remaining life cycle and/or to alter cooling
conditions. The
NETS Laboratory can help companies, universities and governmental
institutions solve
the above issues.
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Measurement of the Thermal Conductivity of
Thin-Films
- Measure the transient surface reflectance and
calculate the thermal
properties of a wide array of submicron thin-film materials used in
high performance ICs, IR detectors, and TECs.
- The TTR
laser-based technique was extended to the
measurement of the thermal properties of optically transparent
dielectric materials by using an approach that involves:
- covering the dielectric material with a
thin-film metallic surface,
- measuring the optical reflectance of the top
metallization layer, and
- solving an inverse heat transfer problem.
Consequently, the thermal properties of the embedded dielectric
material will be inferred.
- Thermal
property measurements, both in-plane and through-plane
- 7
ns pulse width of the heating laser
- Probing
spot diameter smaller than 0.7 microns
- Computer
controlled probing for up to 8-inch samples
- Sample base
maintained at fixed temperature (0°-200°C)
Non-Contact Temperature
Measurements of Active Devices
- Measure the channel temperature of various electronic
devices rangind from simple transistors to HFET and
pHEMT MMICs,
while characterizing their scalar electrical performance (i.e. gain and
output power).
- Probing spot
diameter smaller than 0.8 mm
- Less than ±
2°C uncertainty over a 200°C temperature range
- Automated probing
of a sample’s surface along a prescribed trajectory
- Five (5) MHz
tracking capability of temperature variations
Consulting: Diagnosis of
Microelectronics and
Improvement of Design
- During design, engineers
are looking for avoiding to the extent possible thermal issues
altogether by intelligent concurrent electro-thermal analysis.
- The NETS Lab thas the
experience and the tools necesary to aid analysis and design of complex
microelectronic devices.
- Both experimental and
numerical components are available to enable the design of better,
faster, more reliable devices while helping shorten the design cycle
time.
- The personnel of NETSL can
also help diagnose the performance of existing active microelectronic
devices by non-invasively mapping their surface temperature and then
extracting the thermal behavior of embedded features, which cannot be
otherwise accessed.
- Consulting is also
available for construction of new TTR systems.
TMapper
- A software package called
TMapper has been created by NETSL to facilitate the use of the new
self-adaptive, thermal modeling computer code by anybody through the
Internet
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