Smart photonic light delivery system for use in PDT in esophageal cancer ( dissertation research)
Design, fabrication, and analysis of InGaAsP high power semiconductor lasers for the light delivery system to be used in photodynamic therapy ( conducted thermal analysis, design mask, fabricate lasers, perform laser testing).
Development of numerical models to analyze microwave heat enhanced oxygen level , molecular oxygen diffusivity and light penetration during the photodynamic therapy.
Blue LED blanket for neonatal jaundice May 2005-August 2005
· Design and fabrication of InGaAs blue LED’s for low heat generation.
· Conducted thermal analysis to understand the optimization of the LED drive power for low heat generation.
· Conducted experiments to evaluate the performance of individual and populated LED’s.
Direct de-ionized water-cooling of semiconductor devices (patent pending) -2005
· Conducted photonic device testing for direct de-ionized water-cooling for high performance.
· Design and fabrication of test set up for the uni-directional and multi-directional semiconductor cooling.
· Fluid flow modeling and failure analysis.
Analysis of module level and chassis level electronic packaging of laser drivers- 2006
· Thermal and vibration analysis of module level and chassis level electronic packaging (component level packaging of hardware and cooling fans, component level packaging of multiple microprocessors).
· Optimization of convection heat transfer in chip on board microprocessors. Thermal management of chassis level electronic packaging.
· Finite element thermal and fluid modeling of module level semiconductor packages.
Permanently implantable CSF pressure sensor-2006
Design and development of permanently implantable intracranial pressure sensor to monitor CSF pressure.
Finite element analysis with ANSYS.
Design, fabrication and analysis of micro channel semiconductor-cooling package.
Conducted studies to develop a high efficient micro-channel cooling package for high heat generating semiconductor devices (Sub-mounting, wire bonding and encapsulation of semiconductor lasers, LED, and micro processors).
Finite element analysis with FLUENT and FLOTHERM